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The polishing solution for CMP according to the invention comprises abrasive grains, an additive and water, and the polishing solution comprises an organic compound ...
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Sample preparation supplies and equipment for materials applications.
China Lab Sample Preparation Grinder Mill, Ore and Mineral Grinder Mill, Find details about China Grinder Mill, Grinding Mill from Lab Sample Preparation Grinder Mill ...
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A method for producing and using an ultrapure colloidal silica dispersion is disclosed. The ultrapure colloidal silica dispersion has less than 200 ppb of each trace ...
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Sometimes clients require small particle sizes for testing purposes. SMS can provide grinding services of energetic and inert materials for testing.
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A fixed abrasive, chemicalmechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices, memory disks or the like.
A CMP polishing slurry of the present invention, contains cerium oxide particles, a dispersant, a polycarboxylic acid, a strong acid having a pKa of its first ...
Qualitest introduces our new advance Sample Preparation machines ... Qualitest offers high quality instruments and consumables for Grinding Polishing Sample ...
Disclosed is a method of planarizing a diamond film which generally includes orifices in the surface. The method includes first polishing the diamond film surface to ...
Disclosed is a polishing agent comprising: water; tetravalent metal hydroxide particles; and an additive, wherein the additive contains at least one of a cationic ...
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The invention relates to a composition in the form of a dispersion or a slurry for chemomechanical polishing (CMP), ... during preparation of ... dried sample ...
The school finance machinery starts grinding. ... I solicited questions from several people in preparation of this ... because the sample was not of Democratic ...
8/16/2010 . 8/30/2010 126775 . 7/1/2010 36900 . 10/7/2009 32312. 8/2/2010 . 8/20/2010 . 9/9/2010
Method for planarizing a semiconductor device having a amorphous layer ... In an experiment conducted on a sample wafer with the above ... Surface grinding machine:
An ultrapure colloidal silica dispersion comprising colloidal silica particles having a mean or aggregate particle size from about 10 to about 200 nm, wherein the ...
Feedforward and feedback control for conditioning of chemical mechanical polishing ... Control for Conditioning of Chemical Mechanical ... preparation of an ...
A method of chemical mechanical polishing a surface of a substrate including the step of: contacting the substrate and a composition including a plurality of ...
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